®
The MEMS Equipment Company™
 


XACTIX, Inc.
2403 SIDNEY STREET
SUITE 300
PITTSBURGH, PA 15203
USA

TEL: (412) 381-3195
FAX: (412) 381-1136

US Sales:
ussales@xactix.com

International Sales:
intsales@xactix.com

Support:
support@xactix.com

©1998-2009 XACTIX, Inc.
All rights reserved.
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The X3 Series Xetch®

 

 

Patent pending

The X3 Series Xetch® builds upon the popular X2 Series Xetch adding numerous improvements from ranging from increased etch rate to additional safety features. The X3 Series Xetch is the leading solution for those seeking a cost effective R&D through pilot production xenon difluoride etch system. Built for reliability, flexibility, simplicity and, low cost of ownership, the Xetch® is well suited for both industrial users and research facilities.

Key Features

  • Reliability: Customers testify that the Xetch is the most reliable piece of equipment in their facility.
  • Repeatability: The Xetch provides superior consistency accross wafers using the same recipe.
  • Flexibitlity: The process chamber can accommodate a variety of substrates:
    • X3B: wafers of any size up 6" (150mm) as well as parts of wafers, die or even packaged chips.
    • X3C: wafers of any size up 8" (200mm) as well as parts of wafers, die or even packaged chips.
    • X3M *NEW*: 4" (100mm) and 6" (150mm) cassettes as well as parts of wafers, die or even packaged chips.
  • Sophisticated Control: The Xetch control software manages recipes, logs data and manages multiple users.
  • Etch Rates: Dual expansion chambers provide shorter etch times.
  • Cost of Ownership: A small footprint, easy utilities and robust design keep the cost of ownership low.
  • Meets CE and SEMI S2 standards

    Last Updated September 11, 2006