Following
the formula:
2XeF2+Si
=> 2Xe + SiF4
The
amount of silicon consumed per gram of XeF2 is calculated. For
a 4-inch wafer, assuming the entire top surface is being etched
(usually the majority of the wafer is masked), 1 gram of XeF2
will etch about 2 um of silicon. If only 10% of the wafer was
being etched, 1 gram of XeF2 would etch approximately 20 um
of silicon. The Xetch is set up so that one may fit two, 2000
grams bottles of XeF2 in the system (bottles are easy to change).
System
Geometry
The
Xetch® X3 is delivered in its standard configuration with
two xenon difluoride expansion chambers and the provision
for the
installation of two xenon difluoride source bottles (not
included with the system).
Wafer capacity
The
Xetch® is designed to be manually loaded for superior substrate
geometry flexibility. This flexibility is a key feature since
it allows the easy processing of MEMS devices ranging from die
sized devices, very fragile or thin substrates, and stanfard
full wafers.
Wafer
size limitations
The
unit comes in two versions,
a system which is optimized for 6" wafers or smaller parts
and a system which is optimized for 8" wafers or smaller
parts.
Software
Control
The
unit comes ready to use with a friendly software interface controlled
from a touch screen display. The Xetch® software may be
run in one of three operating modes that can be used during
an etch. Only one operating mode (Normal) is included with the
system. The others are optional upgrades.
- The
normal mode (included at delivery): utilizes a pulsed etch
with a set xenon difluoride pressure and etch time.
-
An advanced normal etch mode (optional upgrade): allows for
the user to set the default base pressure between cycles.
- The
flow through mode (optional upgrade): creates a continuous
flow of xenon difluoride.
Imaging
Upgrade
The
Xetch can be upgraded with an imaging system that includes a
camera system, fully interfaced to the control computer. The
control software is upgraded so that part of the touch screen
shows images of the sample under etch.
Ethernet
Control Upgrade
The
Xetch can be upgraded to be monitored and/or controlled from
a remote computer hooked up through an ethernet network.
Utility
requirements
- 100-120
Volt AC/ 20 Amps for system excluding vacuum pump, which requires
10A
- Nitrogen
lines for process N2, vent N2, and gas box purge N2: 10-20
psi
- Compressed
Dry Air: 70-100 psi
- Fume
exhaust from roughing pump, gas box, and chamber ventilation
shroud
Dimensions
and Weight
- System
Frame: 80cm wide X 60cm deep X 175cm high
- Height
to top of LCD monitor 66"
- Weight
approximately 500 lbs
Warranty
and installation
- 1-year
parts and labor
- Free
software updates for one year from acceptance.
- Installation
is included in the system price
- Installation
takes 1 day, and 1 further day for operator training is also
included in the system price.
- Final
Verification Test at the Customer’s Site
Last
Updated September 11, 2006
