®
The MEMS Equipment Company™
 


XACTIX, Inc.
2403 SIDNEY STREET
SUITE 300
PITTSBURGH, PA 15203
USA

TEL: (412) 381-3195
FAX: (412) 381-1136

US Sales:
ussales@xactix.com

International Sales:
intsales@xactix.com

Support:
support@xactix.com

©1998-2009 XACTIX, Inc.
All rights reserved.
Terms of use.

 

 

 

 

 

 

 

 



 

 

 

Welcome to the XACTIX Website

XACTIX, Inc. develops and produces equipment used for: releasing micro electromechanical systems (MEMS), failure analysis and etching transitoinal metals such as Mo, Ti, Ta, W, TiN and TaN.

Xetch® Systems
XACTIX is the manufacturer of the Xetch® xenon difluoride (XeF2) etching systems, the X3 Series™ for commercial customers, the e1 Series™ for university customers, the X3M for batch processing, the XT series for larger substrates and the XALD serices for integration with OEM partners.

These dry isotropic etching tools are popular in the MEMS community due to high selectivity to silicon versus many standard films including photoresist, silicon dioxide, silicon nitride, and aluminum. The Xetch® systems are particularly well suited for release, but are certainly not limited to MEMS applications and are useful for many applications where highly selective isotropic silicon etching is required. For more information on the unique advantages of xenon difluoride etching, please look at our pdf brochures about Releasing MEMS and Failure Analysis .

 

CVE Module for Volume Production
The CVE module was jointly designed by XACTIX and its partner Surface Technology Systems (STS). It includes a break through chamber design which provides high etch rates, uniformity and efficiency. It is designed to fit on the STS cluster platforms allowing the integration of multiple XeF2 modules with the full line of plasma modules availale from STS. For more information see the press release and the system brochure

Last Updated April 31, 2010