|
Welcome
to the XACTIX Website
XACTIX,
Inc. develops and produces equipment used for: releasing micro electromechanical
systems (MEMS), failure analysis and etching transitoinal metals
such as Mo, Ti, Ta, W, TiN and TaN.
Xetch®
Systems
XACTIX
is the manufacturer of the Xetch® xenon difluoride (XeF2) etching
systems, the X3 Series™
for commercial customers, the e1
Series™ for university customers, the X3M
for batch processing, the XT series
for larger substrates and the XALD
serices for integration with OEM partners.
These
dry isotropic etching tools are popular in the MEMS community due
to high selectivity to silicon versus many standard films including
photoresist, silicon dioxide, silicon nitride, and aluminum. The
Xetch® systems are particularly well suited for release, but
are certainly not limited to MEMS applications and are useful for
many applications where highly selective isotropic silicon etching
is required. For more information on the unique advantages of xenon
difluoride etching, please look at our pdf brochures about Releasing
MEMS and Failure Analysis
.
CVE
Module for Volume Production
The
CVE module was jointly designed by XACTIX and its partner Surface
Technology Systems (STS). It includes a break through chamber design
which provides high etch rates, uniformity and efficiency. It is
designed to fit on the STS cluster platforms allowing the integration
of multiple XeF2 modules with the full line of plasma modules availale
from STS. For more information see the press
release and the system brochure
Last
Updated April 31, 2010
|
