The Xetch® X4 SeriesTM is the leading XeF2 etch system for releasing MEMS devices. Its accelerated etch rates and superior components make it ideal for applications from intensive R&D to pilot production.
Full size photo- Overview
- Specifications
- Software Control
- Upgrades
- Utility Requirements
- Warranty & Installation
- Equipped with our patented dual expansion chamber design for high etch rates
- Allows for high XeF2 gas flow and pressure without dilution from carrier gases
- Provides both pulsed and continuous flow etch processes
- Unique expansion chamber based design contributes to precise, repeatable pulse pressure and ease of mixing XeF2 with other gases
- Customizable chamber size can be matched to the wafer size resulting in maximized etch rates, uniformity and efficiency
- Easy to use, reliable and safe
Dimensions and Weight
- System dimensions (not including attached subsystems): 720 mm wide X 650 mm deep X 1530 mm high
- Height to top of LCD monitor: 1760 mm
- Weight approximately: 225 kg
System Geometry
The Xetch® X4 is delivered in its standard configuration with two xenon difluoride expansion chambers and the provision for the installation of two xenon difluoride source bottles (not included with the system).
Wafer capacity
The Xetch® X4 is designed to be manually loaded for superior substrate geometry flexibility. This flexibility is a key feature since it allows the easy processing of MEMS devices ranging from die sized devices, very fragile or thin substrates, and standard full wafers.
Wafer size limitations
The Xetch® X4 Series includes two versions:
- X4B model designed to accommodate 6" wafers or smaller parts
- X4C model designed to accommodate 8" wafers or smaller parts
The Xetch® X4TM system provides a powerful but intuitive graphical user interface. It includes all of the features necessary for loading and unloading wafers, writing and storing recipes, system maintenance and system security. Its main features include:
- Touchscreen and keyboard interface
- Multi-user software interface with password protected access for each user
- Password protected access to maintenance software
- Recipe storage
- Data logging with process run log exportable for viewing in spreadsheet applications
- Logging and real time plotting of the pressure in the process chamber at a specified interval during etching
The following upgrades are available on the x4:
- Imaging Upgrade
- Thin Metal Lid with Viewport
- Advanced Recipe Software Package
- Advanced Experimentation Software & Hardware Package
- 208-230 Volt AC/ 20 Amps max, single phase
- Nitrogen: 10-20 psi
- Compressed Dry Air: 70-100 psi
- Fume exhaust to roughing pump outlet
- 100 cfm to 250 cfm fume exhaust for chamber area, depending on chamber size
- 100 cfm fume exhaust for gas cabinet exhaust
- XeF2 cylinders available directly from XeF2 manufacturers
- 1-year parts and labor warranty
- Free software updates for one year
- Installation and training is included
- Final verification test at the customer's site